Reach announcement*

4 March 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

UK Government Provides Further Investment in Satellite Communications

EnSilica plc (AIM: ENSI), a leading fabless chipmaker of mixed-signal ASICs (Application Specific Integrated Circuits), notes the announcement made by the UK Space Agency today outlining an additional £30 million of funding under its Connectivity in Low Earth Orbit (C-LEO) programme, aimed at directly helping UK firms developing advanced technologies and secure a larger share of the global satellite communications market, reported to be currently worth £40 billion.

Alongside commentary from the UK Space Agency and the UK Government in the announcement, Paul Morris, Vice President of RF & Comms Business Unit at EnSilica, contributed the following:  

"The C-LEO funding has been transformative for our development of chipsets for LEO user terminals, spanning analogue, digital and hybrid beamforming alongside a software-defined modem optimised for 5G NTN. This support has helped us win contracts with key customers who have validated our specifications, while also allowing us to grow our team and deepen our technical expertise. It's a strong example of how targeted public funding can accelerate innovation and strengthen a commercial business case - and we're grateful for the close collaboration with UK Space Agency throughout."

EnSilica will be seeking to secure funding from this second round of investment from the UK Space Agency's C-LEO programme, which has previously awarded EnSilica £10.38 million in non-dilutive funding to develop semiconductor for next-generation mass-market satellite broadband user terminals.

With the satellite market growing at more than 10% per annum, the rapid deployment of low Earth orbit ("LEO") satellite constellations is driving increasing demand for advanced, highly integrated chip solutions that enable reliable high-speed satellite connectivity. This growth spans commercial, defence and national security applications, areas in which EnSilica has established proven expertise.

Ian Lankshear, Chief Executive Officer of EnSilica, added:

"We welcome this further commitment from the UK Space Agency, which reinforces the UK's ambition to play a leading role in the next generation of satellite connectivity, of which EnSilica continues to leverage its expertise to grow market share."

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space & communications, industrial, automotive and healthcare markets, where safety and security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

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