THIS ANNOUNCMENT CONTAINS INSIDE INFORMATION FOR THE PURPOSES OF ARTICLE 7 OF THE MARKET ABUSE REGULATION (EU) 596/2014 AS IT FORMS PART OF UK LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 ("MAR") AND IS DISCLOSED IN ACCORDANCE WITH THE COMPANY'S OBLIGATIONS UNDER ARTICLE 17 OF MAR

10 March 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

New Contract Wins and Programme Upgrades

EnSilica plc (AIM: ENSI), a leading fabless, application-specific chipmaker, is pleased to provide an update on recent contract wins and programme upgrades, which continues to underpin the Company's mid-term outlook.

New Contract Win for Life-Science Analysis Systems

EnSilica has secured a design implementation and manufacturing contract with a leading UK publicly quoted life-sciences technology company.

Under this contract win, EnSilica will provide semiconductor design implementation expertise alongside tape-out management and wafer manufacturing services for a next-generation chip used within advanced life-science analysis systems. The semiconductor will be manufactured at a leading semiconductor foundry, with EnSilica providing the customer with direct access and technical support.

The initial contract value, including engineering services and prototype wafer supply, is approximately US$1.6 million with material revenue contributions commencing in the financial year ending 31 May 2027 ("FY 2027"), with the potential of future additional long-term revenue from future production wafer supply.

New Contract for Wireless Healthcare ASIC Feasibility Study

EnSilica has been awarded a fully funded feasibility study contract by a U.S. healthcare technology company to develop a wireless biosensing and therapeutic controller ASIC. The end application uses cloud-based AI to support treatment for chronic conditions.

The feasibility study has a value of approximately US$200,000 and leverages EnSilica's existing eSi-Sense healthcare technology platform. The study is scheduled to commence in May 2026 and will run for 3 months. A successful study is expected to lead to a multi-million-dollar design and supply agreement.

Upgrade and Extension of Existing Automotive ASIC Programme

The Company is pleased to report an increase in forecast demand for calendar years 2026 to 2028 for its existing automotive ASIC contract with a premier global OEM brand. This increase in volumes is expected to generate additional revenues in excess of US$4 million over calendar years 2026 and 2028.

The Company is also pleased to report that production volumes for this programme are now expected to extend beyond 2030, increasing the estimated lifetime value of the programme to in excess of the previously forecast value of US$40 million.

Outlook

These new engagements and programme updates further strengthen the Company's confidence in achieving market consensus forecasts for the current financial year ending 31 May 2026 ("FY 2026") as well as FY 2027.

The Board remains confident of delivering a substantial increase in revenues and EBITDA profitability for FY 2026 and reiterates its current guidance for FY 2026 of revenues of between £28 million to £30 million and EBITDA profits of between £3.5 million and £4.5 million.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"These new contract wins and programme upgrades reflect the continued demand for EnSilica's capabilities across our key growth markets, including multiple engagements across the satellite communications arena. 

This encouraging momentum further strengthens our revenue visibility and supports the Board's confidence in the Company delivering sustained revenue growth and generating near-term cash-generation."

The person responsible for arranging release of this announcement on behalf of the Company is Ian Lankshear, Chief Executive Officer.

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety and security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.