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EnSilica plc announced on 30 March 2026 that it has filed an application with the OTC Markets Group. This application is for the Company's ordinary shares of 0.1 pence each to be publicly cross-traded on the OTCQB Venture Market, while the shares will continue to trade on AIM under the ticker "ENSI".
| Date | 30 Mar 2026 |
| Time | 13:20:00 |
| Category | Miscellaneous |
| ID | 6691Y |
30th March 2026
NEWS RELEASE
("EnSilica", the "Company" or the "Group")
Intention for shares to cross-trade on the OTCQB Venture Market in the USA
EnSilica plc (AIM: ENSI), a leading fabless, application-specific chipmaker, announces that it has filed an application with the OTC Markets Group ("OTC") for the Company's ordinary shares of 0.1 pence each ("Ordinary Shares") to be publicly cross-traded on the OTCQB Venture Market (the "OTCQB Market"). Subject to approval, the OTCQB Market will provide easier access to trading in the Ordinary Shares to investors in North America.
The Ordinary Shares will continue to trade on AIM under the ticker "ENSI". A further announcement will be made once the application is approved.
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EnSilica plc Ian Lankshear, Chief Executive Officer Kristoff Rademan, Chief Financial Officer |
via Novella Communications +44 (0)20 3151 7008
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Allenby Capital Limited (Nominated Adviser & Joint Broker) Jeremy Porter / Vivek Bhardwaj (Corporate Finance) Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking) |
+44 (0)20 3328 5656 |
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Panmure Liberum Limited (Joint Broker) Edward Mansfield / Will King / Phoebe Bunce |
+44 (0)20 3100 2000
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Novella Communications (Investor & Financial Public Relations) Tim Robertson / Aeliya Bilgrami |
+44 (0)20 3151 7008 ensilica@novella-comms.com
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About EnSilica plc
EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety and security and reliability are critical.
A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.