This announcement contains inside information for the purposes of Article 7 of the Market Abuse Regulation (EU) 596/2014 as it forms part of UK law by virtue of the European Union (Withdrawal) Act 2018 ("MAR") and is disclosed in accordance with the Company's obligations under Article 17 of MAR

1 June 2026

EnSilica plc

("EnSilica" or the "Company")

Automotive Manufacturing and Supply Contract Win

Expected to deliver $75 million in revenue over 7 years

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce a new 7 year manufacturing and supply contract to produce an Arm based sensing chip for a German manufacturer of automotive components (the "Contract").

EnSilica was awarded the Contract after completing a competitive tender process. As the chip is already in production, no design or tape-out is required. EnSilica will now be responsible for the manufacturing and supply of the chip to the customer.

The Contract is expected to generate around $75 million in revenue over seven years, with approximately $4 million of revenue expected in the financial year ending 31 May 2027, with a gross margin reflecting the manufacturing-only nature of the Contract.

EnSilica was selected over a number of competing suppliers, reflecting the Company's growing expertise in the automotive sector and track record of delivering chip production at scale.

Ian Lankshear, CEO of EnSilica, commented:  

"We are pleased to have secured this Contract, which will not only generate material future revenues but is expected to also deliver significant strategic benefits for EnSilica.

The Contract opens up a connection to a Tier 1 German automotive supply chain, increases wafer volume shipments through our partner foundries - reinforcing our position as a key customer - and it secures the VDA-aligned automotive quality standard required to operate within the German automotive sector.

It also places EnSilica in a stronger position to secure future higher-margin ASIC design opportunities in this important market."

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About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04