22 July 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Follow-on Orders worth €1.1 million for Satellite Communications ASSP

EnSilica (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce follow-on chip orders worth €1.1 million from a European satellite communications customer.  The orders are for EnSilica's ENS92040 distributed digital beamformer Application Specific Standard Product ('ASSP') for the satellite communications user terminal market.

History of the ENS92040 digital satellite beamformer ASSP:

·   In February 2023, EnSilica announced funding of €5 million from the European Space Agency ('ESA') to develop a new chip for satellite broadband user terminals, which is the ENS92040 digital satellite beamformer ASSP, and is now a key component of the Group's satellite communications user terminal chip set.

·   In August 2023, EnSilica announced a €2.5 million order from the European satellite communications customer for ENS92040, acquiring early, but not exclusive, access and an initial order for 50,000 of the ASSP.

·   Today, the same customer has committed a further €1.1 million for the ASSP, comprising €350,000 for additional samples and €750,000 to contribute towards product enhancements.

The ENS92040 is a highly integrated distributed digital beamformer chip that performs high-speed data conversion, digital signal processing and beamforming for electronically steerable flat-panel satellite communications user terminals. The device enables scalable, low-power user terminals for next-generation LEO, MEO and GEO satellite broadband constellations. It is also one of the ASSPs identified for further investment as part of the Company's recently announced equity fundraising. Supply revenue is expected to grow significantly from 2029, as this new generation of satellite constellations enter service. 

The satellite communications user terminal market has a Serviceable Addressable Market which is expected to grow by 5x, up from $650m in 2025 during initial deployment and growing to over $3bn alongside mass adoption in 2030.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"These follow-on orders demonstrate continued commercial momentum for the ENS92040 and represent another important milestone as the device progresses towards production. The production phase is expected to align with new satellite constellations coming into service from 2029, when high-volume supply is anticipated.

The ENS92040 development programme validates our strategy of combining ESA-funded innovation with proprietary ASSPs that address the rapidly growing satellite communications market and reinforces our confidence in the long-term commercial opportunity for this exciting product family."

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About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04