3 August 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

€1.7 Million Contract for Second Phase of Satellite Payload Communications ASIC Programme

and

EnSilica Joins European 5G Satellite User Terminal Project

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce that it has secured a second contract worth €1.7 million from a leading European satellite manufacturer. The contract follows the completion of an earlier funded feasibility contract for a new satellite payload communications ASIC programme, which was one of the three satellite payload feasibility studies announced by the Company on 3 November 2025.

This second contract represents the next phase of the original engagement, and is expected to be delivered over approximately 10 months. Building on the feasibility study, EnSilica will develop the system architecture, signal processing algorithms and systems demonstrator device required before the ASIC enters the full development phase.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"We are delighted to have been selected again by this key European satellite manufacturer to continue this important programme. The contract further strengthens EnSilica's position as a leading European supplier of complex communications ASICs for the space and communications sector and reflects our growing expertise in satellite payload and advanced digital signal processing.

We are pleased to be trusted to continue, and we look forward to working closely with the customer as the programme progresses towards full ASIC development."

European 5G Satellite User Terminal Project

In addition, EnSilica is pleased to be partnering in the 5G-aNTeNna project, a European collaboration led by Silicon Austria Labs targeting the European Union's IRIS² satellite constellation, which serves government, defence and enterprise users.

The consortium of six European partners is developing a compact user terminal combining 5G non-terrestrial network connectivity (5G-NTN) with efficient phased array antennas intended to deliver resilient Ka-band broadband, with EnSilica providing the key satellite user terminal ASSPs (Application Specific Standard Products). The project places EnSilica in the ground segment of Europe's sovereign satellite infrastructure and gives it a platform to address the wider satcom market as it moves to 5G-NTN.

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About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04