New Contract Win & Completed Tape-out of ASIC

29 October 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Healthcare ASIC Contract Win

&

 Life-Sciences ASIC Tape-Out Complete

Feasibility study converts into full development and supply agreement with US healthcare customer & UK life-sciences ASIC moves into fabrication

EnSilica plc (AIM: ENSI), a leading fabless, application-specific chipmaker, is pleased to announce a new ASIC development and supply contract with a US healthcare technology company, worth approximately US$2.4 million in development revenues, the feasibility study for which commenced earlier this year. In addition, the Company announces the successful tape-out of a next-generation ASIC for a UK publicly quoted life-sciences technology company, representing a key step under the previously announced US$1.6 million life sciences contract.

Both programmes were first announced by the Company on 10 March 2026, and have now reached significant milestones.

New Healthcare ASIC Development and Supply Agreement

EnSilica has successfully converted an initial feasibility study by signing a US$2.4 million development and supply agreement with the customer. The programme involves the development of a wireless biosensing and therapeutic controller ASIC, with the end application using cloud-based artificial intelligence to support the treatment of chronic conditions.

The device is being developed to treat a prevalent chronic condition affecting tens of millions of people in the United States and hundreds of millions worldwide. This represents a significant potential market for the customer's device and, subject to successful development, regulatory approvals and commercial adoption, could lead to substantial long-term ASIC supply volumes.

EnSilica will undertake the full ASIC development programme over an expected 18-month period, and in addition, the agreement provides a framework for EnSilica to supply the ASIC over the product's commercial lifetime, representing a potentially significant recurring revenue opportunity.

Successful Tape-Out of Life-Sciences ASIC

EnSilica has completed the tape-out of an ASIC being developed for a leading UK publicly quoted life-sciences technology company.

The contract, valued at c.US$1.6 million, covers design implementation, tape-out management and prototype wafer manufacturing services for a chip used within advanced life-science analysis systems.

With tape-out complete, the design is now progressing to fabrication at a leading foundry, and EnSilica will continue to support the customer through wafer manufacturing and into production. The majority of revenue from the contract is expected to be recognised in this financial year ending 31 May 2027, with the potential for additional long-term revenue from future production wafer supply.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"We are delighted to have converted the feasibility study for our healthcare customer, announced in March, into a multi-year development and supply agreement. The scale of the market for the customer's device is clear, creating the potential for significant chip volumes as the product progresses towards commercialisation.

Additionally, completing tape-out for our UK life-sciences ASIC is another important milestone, underlining our team's ability to execute complex design and manufacturing chip programmes, and to deliver against customer commitments.”

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About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, healthcare and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil, Hungary and Italy.

LEI: 213800R6VXRU7MJTAF04