Subject: The Company's Board of Directors approved the issuance of unsecured corporate bond

Date of events:2023/05/11

Contents:

1.Date of the board of directors resolution:2023/05/11

2.Name [issue no.__ of (secured, unsecured) corporate bonds of

___________ (company)]:

Hon Hai Precision Industry Co., Ltd. unsecured corporate bond issue

3.Whether to adopt shelf registration (Yes/No):No

4.Total amount issued: Aggregate amount not exceeding NTD45,000,000,000

(can be issued at once or in installments)

5.Face value per bond:NTD1,000,000

6.Issue price: At par

7.Issuance period:

Depends on market condition, may with same or different tenors

8.Coupon rate: Fixed coupon rate to be determined at pricing

9.Types, names, monetary values and stipulations of collaterals: NA

10.Use of the funds raised by the offering and utilization plan:

Debt repayment and / or working capital replenishment

11.Underwriting method: Public offering by underwriter

12.Trustees of the corporate bonds: To be decided

13.Underwriter or agent: To be decided

14.Guarantor(s) for the issuance: NA

15.Agent for payment of the principal and interest: To be decided

16.Certifying institution: NA

17.Where convertible into shares, the rules for conversion: NA

18.Sell-back conditions: NA

19.Buyback conditions: NA

20.Reference date for any additional share exchange, stock swap, or

subscription: NA

21.Possible dilution of equity in case of any additional share exchange,

stock swap, or subscription: NA

22.Any other matters that need to be specified: None