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| TIDM | HHPD |
| Share Price | Loading... |
| Market Cap | Loading... |
Hon Hai Precision Industry Co., Ltd.'s Board of Directors approved the issuance of unsecured corporate bonds on November 12, 2025. The aggregate amount of the issuance will not exceed NTD50,000,000,000, with a face value of NTD1,000,000 per bond, issued at par. The funds raised are allocated for debt repayment and/or working capital replenishment.
| Date | 12 Nov 2025 |
| Time | 10:04:56 |
| Category | Miscellaneous |
| ID | 2487H |
Subject: The Company's Board of Directors approved the issuance of unsecured corporate bond
Contents:
1.Date of the board of directors resolution: 2025/11/12
2.Name [issue no.__ of (secured, unsecured) corporate bonds of ___________ (company)]:
Hon Hai Precision Industry Co., Ltd. unsecured corporate bond issue
3.Whether to adopt shelf registration (Yes/No): No
4.Total amount issued:
Aggregate amount not exceeding NTD50,000,000,000
(can be issued at once or in installments)
5.Face value per bond: NTD1,000,000
6.Issue price: At par
7.Issuance period: Depends on market condition, may with same or different tenors
8.Coupon rate:
Fixed coupon rate to be determined at pricing
9.Types, names, monetary values and stipulations of collaterals: NA
10.Use of the funds raised by the offering and utilization plan:
Debt repayment and / or working capital replenishment
11.Underwriting method: Public offering by underwriter
12.Trustees of the corporate bonds: To be decided
13.Underwriter or agent: To be decided
14.Guarantor(s) for the issuance: NA
15.Agent for payment of the principal and interest: To be decided
16.Certifying institution: NA
17.Where convertible into shares, the rules for conversion: NA
18.Sell-back conditions: NA
19.Buyback conditions: NA
20.Reference date for any additional share exchange, stock swap, or subscription: NA
21.Possible dilution of equity in case of any additional share exchange, stock swap, or subscription: NA
22.Any other matters that need to be specified: None